Description

The EPSM-10GX4 is a managed Ethernet switch module in an ultra-compact 2.2" x 3.3" (55 x 84mm) size offering 24 10/100/1000Mbps copper ports + 4 10Gbps SFI ports. The module is intended to be used on a carrier board, such as Diamond's EPS-24G4X, to implement a complete Ethernet switching solution. The core Ethernet switching technology is almost fully encapsulated on the module; for many applications, only the "last inch" of magnetics and I/O connectors is required to complete the circuit, enabling easy development of custom form factor compact, rugged Ethernet switch solutions.

The small size, based on the industry-standard COM Express Mini form factor, makes EPSM-10GX a perfect choice for use as a building block for creating custom Ethernet switch solutions in a variety of space-demanding applications, such as drones, ground and underwater vehicles, and robots.

Customers looking for a complete off-the-shelf solution may be interested in our EPS-24G4X, which provides all of the switch's features in the industry standard 3.5 inch form factor with integrated latching I/O connectors and SFP+ sockets. Diamond Systems also offers custom carrier board design services to provide a perfect fit solution for your application.

Two software packages are available, Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to support an external precision clock circuit and 1pps signal source provided by the carrier board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.

Two cooling accessory options are available: A heat sink provides convection cooling in a low profile, while a heat spreader provides improved conduction cooling for superior high temperature performance in applications where physical contact with the system enclosure is available.

Two high-speed fine-pitch connectors provide all power and data communications between the module and the carrier board. The first connector provides power, 9 10/100/1000 ports, the serial interface, and a serial LED data stream. Applications requiring 9 ports or less may use just this connector. The second connector contains 3 more 10/100/1000 ports, QSGMII signals for an additional 12-port PHY to provide 12 additional 10/100/1000 ports, and the 4 10G SFI ports.

EPSM-10GX4 is designed to meet the challenges of vehicle environments with its 50% thicker PCB, -40/+85°C operating temperature range, and MIL-STD-202G shock/vibration resistance.

Embedded Software

Two software packages are available for EPSM-10GX4, Layer 2+ switching and Layer 3 routing/switching. In addition, IEEE-1588 precision time protocol support is available with a minor modification to support an external precision clock circuit and 1pps signal source provided by the carrier board. All software features are manageable via a GUI web interface accessible over any port, as well as with a command language accessed via a built-in RS-232 port.

The table below shows some of the more popular features available. For a complete list of features available in each software package, click here.

Layer 2+ software highlights include the following:
8K MAC addresses and 4K VLANs (IEEE 802.1Q)
8K IPv4 and IPv6 multicast group support
Jumbo frame support at all speeds
Flexible link aggregation support based on Layer-2 through Layer-4 information (IEEE 802.3ad)
Multicast and broadcast storm control, as well as flooding control
Rapid Spanning Tree protocol (RSTP) and MSTP
Multiple protocol support: IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1X
8 priorities and 8 QoS queues per port with scheduling

Layer3 software additional highlights:
Hardware- and software-based IPv6 L3 static routing
RFC 2328 OSPFv2 dynamic routing
IEEE 1588 precision time protocol (PTP)
RADIUS accounting
Port and Queue policers

Cooling Options

Both heat sink and heat spreader cooling options are available. The heat spreader is the preferred choice for applications where the packaging design permits its use. It includes an integrated thermal pad for improved contact with the enclosure wall. For customer's designing their own cooling solutions, Diamond can provide 3D files and other design support.